Publish Time: 2022-01-26 Origin: Site
At present, traditional manufacturing is facing in-depth conversion and upgrading, high-end precision machining high added value and high-tech barriers are one of the important directions. With the increase in high-precision machining demand, the relevant precision processing technology is also developed rapidly, with laser technology to get more and more recognition in the market.
Laser processing technology is divided into three levels and processing accuracy requirements according to the size of the processing material: laser processing technology of large materials is based primarily based on medium and thick board, and the processing accuracy is generally in millimeters or sub-percentage; precision lasers are mainly based on thin plate processing technology, which processes Accuracy is usually in ten microl levels; laser microcloyment techniques are mainly based on various films having a thickness of less than 100 μm, typically with processing accuracy of less than 10 microns or even submicron. Today we mainly introduce precision laser processing.
Laser precision machining can be divided into four types of applications, namely precision cutting, precision welding, precision drilling and surface treatment. In the current technology development and market environment, laser cutting and welding applications are more popular, 3C electronics and new energy batteries are currently the most widely used field.
Laser precision cutting
The laser precision cutting uses a pulsed laser beam to focus on the surface of the machining object to form a high energy density point, which melts or evaporates the processing material at a transient high temperature. Its processing characteristics are high-speed, smooth and flat cuts, generally not subsequent processing; small cutting heat affected zones, small plate deformation: high machining accuracy, good repetitiveness, no damage to material.
Compared to high-power laser cut, precision cut is usually used according to nanoseconds and picosecond lasers of processing objects, which can focus on ultrafine spatial regions and have extremely high peak power and extremely short laser pulses. The effect of surrounding materials on the spatial range, thereby achieving \"super fine \" processing. Laser precision cutting technology has unparalleled advantages in the production process, requires high precision, such as mobile phone screen cutting, fingerprint identifier board and LED invisible cutting.
Laser precision welding
Laser Precision Welding is the work area that irradiates high-strength laser beams to the machining product. The multi-density heat source region is quickly formed in the welding region by interaction between laser and material. The heat can be melted to weld the region and then cool. Crystallization forms solid solder joints or seams. Its characteristic is that it does not require electrodes and filler materials, and belongs to non-contact welding. Welding high melting point refractory metal or different thicknesses.
In the new energy battery area, with the promotion of new energy vehicles, the demand for power batteries continues to increase. Laser welding is the standard welding standard in the battery. It is widely used in the front protruding sheet, the bottom cover, the top cover, and the sealing spike sold in the intermediate portion, and the rear battery connector and negative sealing welding. In the 3C domain, various modules of mobile phones, medium cover, and the like are inseparable from laser precision welding technology.
The laser precision drilling is to reduce the diameter of the spot to the micrometers, thereby obtaining a high laser power density, and can perform laser drilling in almost any material. It is characterized by having a high hardness, brittle or softness of material, with a small aperture, fast processing speed, high efficiency.
What is the application of laser precision machining?
Laser drilling is the most widely used in the PCB industry. Compared to the traditional PCB drilling process, the laser is not only faster on the PCB, but also a hole, micropore, and a drilled hole below 2 μm, which is unable to achieve conventional equipment. Hole. On the surface of the electronic product, it can also be used for drilling on glass speakers, microphones.
Laser surface treatment
The laser surface treatment is to use high power density laser beam to surface treatment metal, which can achieve phase change hardening, surface amorphization, surface alloying, or evaporation or altering the color of the surface material color, thereby changing metal materials. Surface characteristics. Its characteristic is that it does not need to use external materials, only the structure of the surface layer of the processing material is changed, and the deformation of the processing portion is very small, suitable for surface markers and high-precision components.
The laser surface treatment can be divided into two categories depending on whether the composition of the substrate is changed. Applications that do not change the composition of the substrate include laser quenching (phase change hardening), laser cleaning, laser hardening, and laser polarization, and those composed of the substrate include laser coating, laser plating, laser alloying, and laser deposition.